SK Hynix, the world's second-largest memory chip maker, has begun volume production of a 12-layer version of its latest-generation high-bandwidth memory (HBM) chip to meet the demands of the current artificial intelligence boom. This is the world's first latest-generation HBM product, called HBM3E, which has 12 layers and is the largest capacity of any existing HBM at 36 gigabytes.